Electroless plating of Pd-P alloys from ethylenediamine complex solutions.

Ultrasound-Assisted Pd Activation Process for Electroless Silver Plating

An ultrasound-assisted activation method for electroless silver plating is presented in this study. When the ultrasound was applied during the activation step, the amount of the Pd species adsorbed on substrate surfaces was higher than that of sample pretreated with a conventional activation process without ultrasound irradiation. With this activation method, it was also shown that the adsorbed...

Laser assisted Pd seeding for electroless plating on SiQ2

Preparation of Pd composite membrane via organic-inorganic activation method in electroless plating technique

A palladium composite membrane was prepared via electroless plating technique using organic-inorganic method during activation process. The ceramic support surface was modified by two TiO2-boehmite and one γ-alumina layers to avoid Pd penetration in support pores. Thin and defect-free Pd composite membrane was obtained by creating a relative smoothness on the ceramic support and using Pd nanopa...

Electroless Nickel Plating with Hypophosphite

In the previous chapter, the components of electroless nickel plating baths were discussed from the viewpoint of the function each performs in the bath, with little attention paid to their effect on the plating process. The metal and the electron source (the reducing agent) are consumed in the electroless plating reaction and so their concentrations in the bath are continuously decreasing. Ther...

Electroless Nickel Plating: Bath Control

In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...